Modeling the Adhesion of Epoxy to Aluminum and Their Separation under Dynamic Loads using Abaqus and LS-DYNA

Abstract

The modeling of adhered surfaces and the prediction of their separation within multicomponent systems is not widely used in the study of armament systems. Approximations commonly made to bound the problem add to the uncertainty of the predicted results and conclusions drawn about the integrity of the system, particularly under highly dynamic load environments. The use of adhesive/cohesive interface models in systems where either a thin film or large bulk volume of epoxy is bonded to an aluminum substrate is investigated in this work. Both quasi-static and highly dynamic loading conditions are considered, with the accelerations varying over three orders of magnitude. The influence of interface model parameters such as adhesive strength, damage evolution models, and comparisons to simple frictional interface models are evaluated. The influence of mesh and geometric simplifications are also discussed, and predictions in two commonly used commercial finite element codes, Abaqus and LS-DYNA, are compared. Recommendations are made regarding the relative sensitivity of predicted results on interface model types and parameters used over the range of loading conditions studied.

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Document Details

Document Type
Technical Report
Publication Date
Feb 08, 2022
Accession Number
AD1159135

Entities

People

  • Catherine S. Florio

Organizations

  • United States Army Combat Capabilities Development Command

Tags

Communities of Interest

  • Energy and Power Technologies

DTIC Thesaurus Topics

  • Adhesion
  • Adhesives
  • Computer Programs
  • Dynamic Loads
  • Engineering
  • Equations
  • Friction
  • High Acceleration
  • Materials
  • Mechanical Engineering
  • Mechanics
  • Modulus Of Elasticity
  • Shear Modulus
  • Simulations
  • Stiffness
  • Three Dimensional
  • Traction

Fields of Study

  • Engineering

Readers

  • Explosive Engineering.
  • Structural Health Monitoring of Composite Structures.
  • Theoretical Analysis.