Integrated Quantum Photonics for Photon-Ion Entanglement
Abstract
This project focused on the realization of an integrated platform for quantum photonics. Photonic Integrated Circuit (PIC) technologies enable the integration of all the components of a quantum photonic system (photon sources, interferometers for manipulating the photon state) onto a high density, phase stable, high efficiency, and high-performance Silicon substrate. However, traditional PIC fabrication has been optimized for classical applications where loss and crosstalk are not as important. In this project we worked with AFRL and AIM Photonics to successfully realize a foundry quantum integrated platform, along with the key device and circuit level building blocks (photon sources, low loss waveguides, interferometers, phase shifters). We also demonstrated robust optical and electrical packaging that enables the chips to be interfaced with optical fiber networks and electrical hardware.
Document Details
- Document Type
- Technical Report
- Publication Date
- Apr 01, 2022
- Accession Number
- AD1166889
Entities
People
- Stefan F. Preble
Organizations
- Rochester Institute of Technology