Test Sample for Measuring Adhesive Strength Under Tension
Abstract
The present invention is a method and apparatus to measure the tensile strength of an adhesive bond between two rigid substrates.
Document Details
- Document Type
- Technical Report
- Publication Date
- Aug 02, 2022
- Accession Number
- AD1182458
Entities
People
- Thomas S. Ramotowski
Organizations
- Naval Undersea Warfare Center