Development of High-Density Wafer-to-Wafer Interconnects to Enable Next-Generation Scientific Instruments for HEP and BES: Program 10089 Final Report

Abstract

MIT LL's focus is on prototype demonstrations rather than high-volume production, and the Laboratory remains dedicated to continuing to provide custom imagers for the government community. Given this background, Program 10089 was initiated to demonstrate the capability for 3D integration via hybrid bonding, at 10 m interconnect pitch. The overall goal was to design a new mask set dedicated to 3D integration via hybrid bonding, and to use that mask set to establish initial 90 interconnect yield on metal monitors, eventually increasing to 99 with further fabrication iterations. The bulk of the work for this program began in early 2020 and ended in mid-2021. Though the program has ended, MIT LL plans to continue to refine its 3D integration processes over the coming months as it represents a strategic capability.

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Document Details

Document Type
Technical Report
Publication Date
Mar 06, 2023
Accession Number
AD1196335

Entities

People

  • Christopher W. Leitz
  • Renee D. Lambert

Organizations

  • Massachusetts Institute of Technology

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Accuracy
  • Acoustic Microscopes
  • Autonomous Systems
  • Bonding
  • Cold Welding
  • Demonstrations
  • Detectors
  • Diameters
  • Electrical Measurement
  • Elementary Particles
  • Flow
  • Geometry
  • Low Temperature
  • Measurement
  • Metals
  • Oxides
  • Urban Areas

Readers

  • Defense Acquisition Program Management
  • Image Processing and Computer Vision.
  • Nanofabrication and Microfabrication.