Smart Manufacturing - Photonic Processing of Multifunctional Materials for Defense Applications
Abstract
The development of high quality, low cost flexible electronics is critically important to future technologies including monitoring and augmenting human performance, as well as enabling sensors, antennas, and multifunctional components for unmanned aerial vehicle (UAV) systems. The fundamental challenge to realizing robust, flexible electronics is in the development of strain resistant high quality conducting, semiconducting and insulating materials. The material quality is, many times, limited by the fact that typical semiconductor device fabrication processes require temperatures that exceed that of the melting temperature of conformal and flexible substrates, restricting the ability to directly grow the materials onto the flexible substrate of interest. To overcome this, the electronic materials must be synthesized at a lower temperature, transferred from semiconductor fabrication compliant substrate to the flexible substrate of interest, or post-processed by various techniques in order to achieve similar material quality and performance. 3D printing combined with transient heating through the use of continuous optical/laser annealing is a comprehensive solution that can overcome this critical barrier to flexible electronics processing.
Document Details
- Document Type
- Technical Report
- Publication Date
- Dec 13, 2021
- Accession Number
- AD1208150
Entities
People
- Daniel Jr Hallinan
- Komalavalli Thirunavukkuarasu
- Okenwa Okoli
- Subramanian Ramakrishnan
- Tarik Dickens
- Zhiyong Liang
Organizations
- Florida A&M University