Cooling Techniques for High Power Electronics Laser Application
Abstract
With significant increases in power dissipation and power density expected in electronic parts to meet future space mission applications, advances in thermal control hardware and techniques will be needed to maintain the mission temperature and reliability. One such application is cooling the electronics associated with space-based lasers. Laser cooling requirements can be satisfied with single- or two-phase heat transport to space-facing radiators with the possible inclusion of phase change materials. Future laser cooling requirements will need more advanced hardware, such as microchannels, spray cooling, and jet impingement. This report describes the thermal control hardware associated with current and future laser cooling needs and provides recommendations for meeting future laser cooling objectives.
Document Details
- Document Type
- Technical Report
- Publication Date
- Apr 28, 2023
- Accession Number
- AD1210860
Entities
People
- John Welch
- Matthew Harrison
Organizations
- The Aerospace Corporation