Radial Combiners Based on Printed Circuit Board Manufacturing with Ball Grid Array Integration (FY23 Progress Report)

Abstract

This NRL memorandum report provides details on FY23 technical progress developing a wideband radial combiner based on printed circuit board (PCB) manufacturing technology. This planar PCB-based combiner circuit is intended for integration with wideband planar antenna array apertures integration that will be accomplished using ball grid array (BGA) technology. Background work leading up to this development, progress through FY23, as well as future directions are all reported below (NOT a final report).

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Document Details

Document Type
Technical Report
Publication Date
Dec 28, 2023
Accession Number
AD1225922

Entities

People

  • Rick W. Kindt

Organizations

  • United States Naval Research Laboratory

Tags

Fields of Study

  • Engineering

Readers

  • Electronics Engineering
  • Integrated Circuit Design and Technology.
  • Public Financial Management and Budgeting