Production Engineering Measures to Manufacture Super Fine Finish Beryllia.
Abstract
Plans were made and initial work started on the development of processes for the manufacturing of beryllia substrates for microwave integrated circuits having a surface smoothness not exceeding four microinches per inch by progressive polishing steps. The primary effort centered on studying lapping variables such as pressure, time, abrasive grit size and material on substrate material removal rate and surface smoothness. The first step in the process must provide a flat surface for subsequent polishing while minimizing the degradation of surface smoothness. The results show that 600 grit abrasive, normally used for rough polishing, can be used for this purpose better than other grits examined.
Document Details
- Document Type
- Technical Report
- Publication Date
- Oct 29, 1974
- Accession Number
- ADA001815
Entities
People
- Glenn H. Rees