SEM Evaluation of Metallization on Semi-conductors,

Abstract

A test method for the evaluation of metallization on semiconductors is presented and discussed. It is applicable to discrete devices and to integrated circuits, and specifically addresses batch-process oriented defects. Quantitative accept/reject criteria are given for contact windows, other oxide steps, and general interconnecting metallization. Figures are provided that illustrate typical types of defects. Apparatus specifications, sampling plans, and specimen preparation and examination requirements are described. Procedures for glassivated devices and for multi-metal interconnection systems are included.

Document Details

Document Type
Technical Report
Publication Date
Jun 15, 1974
Accession Number
ADA004835

Entities

People

  • Donald L. Fresh
  • John W. Adolphsen

Organizations

  • The Aerospace Corporation

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Circuits
  • Compound Semiconductors
  • Electronics
  • Integrated Circuits
  • Metal Oxide Semiconductors
  • Sampling
  • Semiconductors
  • Solid State Electronics
  • Specifications
  • Test And Evaluation
  • Test Methods

Readers

  • Integrated Circuit Design and Technology.
  • Software Engineering
  • Thermal Physics or Thermal Science.

Technology Areas

  • Microelectronics