Materials Bonding.

Abstract

A molding compound based on Ethylene Propylene Diene Rubber (EPDM) was developed and tested for use as a tie material in underwater cable and connector splicing. The development of a tie material permits the use of wire and cable with a range of insulating materials in an underwater cable system, and the restoration of insulation at splices and connectors by molding. The report covers the requirements of a tie material and the formulation, and physical and electrical properties of the compound developed. Use of the compound with polyethylene, polypropylene, and neoprene insulations as well as connector materials such as stainless steel, monel, and beryllium copper is discussed. For each of the above materials, methods of surface preparation and/or treatment prior to molding are given. Molding systems and cycle parameters are outlined.

Document Details

Document Type
Technical Report
Publication Date
Apr 30, 1975
Accession Number
ADA009098

Entities

People

  • Stephen B. King

Tags

DTIC Thesaurus Topics

  • Alkenes
  • Biomedical And Dental Materials
  • Cables
  • Composite Materials
  • Connectors
  • Dielectric Polymers
  • Electrical Properties
  • Ethylenes
  • Films
  • Insulation
  • Materials
  • Polymeric Films
  • Propenes
  • Stainless Steel
  • Underwater Cables

Fields of Study

  • Materials science

Readers

  • Electrical Engineering
  • Metallurgy
  • Polymer Science and Engineering.

Technology Areas

  • Microelectronics