Basic Adhesion Mechanisms in Thick and Thin Films.
Abstract
Seventeen commercial, gold-based thick-film conductor inks and four alumina substrates (two each, 96 and 99.5 wt pct) were characterized physically and chemically. These characterizations were performed on as-received materials. Films were screen-printed and singly fired and refired 5 times in accordance with manufacturer recommendations commensurate with thick-film hybrid microelectronic usage; adhesion strength, conductivity, and other properties of the films were measured and are reported.
Document Details
- Document Type
- Technical Report
- Publication Date
- Jan 31, 1975
- Accession Number
- ADA011906
Entities
People
- Kenneth R. Bube
- Thomas T. Hitch
Organizations
- RCA Corporation