Numerical Studies of End Losses from a LINUS Theta Pinch,

Abstract

In the near future, a large fusion experiment will be performed at the Kurchatov Institute in Moscow by implosion of a cylindrical metallic linear surrounding a plasma and its confining magnetic field. In this scheme, a megagauss field is created by compressing an initial kilogauss field, the plasma is compressed to densities on the order of 10 to the 19th power/cc. The Lawson time for such dense plasmas is reduced to tens of microseconds. Since the system can be contained on this time scale by the inertia at the liner, breakeven can theoretically be achieved. An important limiting factor here, as in all straight theta pinches, is the amount of energy lost out the ends: The longer the theta pinch, the smaller the losses. The minimum length necessary for breakeven is determined by losses due to electron thermal conduction, plasma flow to the ends (convection) and Bremsstrahlung radiation. The losses can, in theory, be partially or totally compensated for by the heating caused by electron collisions with the 3.5 MeV alpha particle from the D-T reaction. The purpose of the work reported here is to study numerically the scaling of these losses with system size and other parameters when the losses are integrated over the compression cycle.

Document Details

Document Type
Technical Report
Publication Date
Aug 01, 1975
Accession Number
ADA014857

Entities

People

  • Paulett C. Liewer

Organizations

  • United States Naval Research Laboratory

Tags

DTIC Thesaurus Topics

  • Alpha Particles
  • Bremsstrahlung
  • Collisions
  • Compression
  • Conduction (Heat Transfer)
  • Convection
  • Corpuscular Radiation
  • Electromagnetic Radiation
  • Electrons
  • Elementary Fermions
  • Elementary Particles
  • Energy
  • Fermions
  • Ionizing Radiation
  • Magnetic Fields
  • Nuclear Radiation
  • Radiation

Fields of Study

  • Physics

Readers

  • Mathematics or Statistics
  • Plasma Physics / Magnetohydrodynamics
  • Pulsed Power and Plasma Physics.

Technology Areas

  • Microelectronics