ARC Plasma Sprayed Microwave Circuits.
Abstract
Gold, copper, aluminum, and aluminum -4.5%(wt.) copper alloy were deposited as microwave integrated circuit metallizations on alumina substrates by arc plasma spraying. Metallization by arc plasma spraying was investigated as an economical method for metallizing ceramic substrates for MIC's and other devices. The emphasis was on simplicity of operation for cost effectiveness over present metallization techniques. The arc plasma and anneal conditions were optimized for each metal type and the resulting films were characterized for D.C. resistivity, microwave Q, and adherence. Copper and gold films exhibited the best overall electrical performance, matching or exceeding the performance of commercially prepared films. The adherence of all metallizations generally exceeded the intrinsic strength of alumina substrates. Aluminum and aluminum-copper alloy metallizations were found to present bonding and soldering complications, making them less cost effective.
Document Details
- Document Type
- Technical Report
- Publication Date
- Aug 01, 1975
- Accession Number
- ADA015077
Entities
People
- D. H. Harris
Organizations
- Monsanto