Multichip Integrated Circuits in UK Spacecraft.

Abstract

The Report covers the development of reliable electronic assemblies for spacecraft. The basic details of the hermetic, integral substrate, ceramic package are described, together with the handling and use of the thick film and active and passive devices. The qualification of the system for two UK satellite programs and its successful performance are discussed.

Document Details

Document Type
Technical Report
Publication Date
Apr 01, 1975
Accession Number
ADA015207

Entities

People

  • D. W. Allen
  • J. A. C. Beattie
  • P. Clarkson

Organizations

  • Royal Aircraft Establishment

Tags

DTIC Thesaurus Topics

  • Artificial Satellites
  • Assembly
  • Circuits
  • Films
  • Integrals
  • Integrated Circuits
  • Qualifications
  • Space Systems
  • Spacecraft
  • Spacecraft Components
  • Substrates
  • Thick Films
  • Vehicles

Fields of Study

  • Engineering

Readers

  • Aerospace Engineering.
  • European Security and Defence Policy (ESDP).
  • Integrated Circuit Design and Technology.

Technology Areas

  • Microelectronics
  • Microelectronics - Graphene
  • Space