ULTRASONIC PROCEDURES FOR THE DETERMINATION OF BOND STRENGTH.

Abstract

Analytical models have been developed that allow the theoretical ultrasonic reflection to be determined from adhesive bondlines having such flaws as a variation in thickness, density or modulus gradient in the adhesive or improper surface preparation of the substrate. These models allow the selection of appropriate ultrasonic inspection equipment by indicating the manner in which the reflection will vary. Computer analysis of these models has shown that these variations occur in the form of amplitude changes in the time domain and spectral shifts in the frequency domain. The experimental phase of the program has indicated that a variation in the substrate surface preparation does give indications predicted by the models and can be detected ultrasonically using the immersion pulse-echo technique.

Document Details

Document Type
Technical Report
Publication Date
Apr 01, 1975
Accession Number
ADA015291

Entities

People

  • Joseph L. Rose
  • Paul A. Meyer

Organizations

  • Drexel University

Tags

DTIC Thesaurus Topics

  • Adhesives
  • Amplitude
  • Computers
  • Frequency
  • Frequency Domain
  • Inspection
  • Reflection
  • Substrates
  • Thickness
  • Time Domain
  • Ultrasonic Inspection

Readers

  • Atmospheric Science / Meteorology, specifically Wind Wave Turbulence.
  • Structural Health Monitoring of Composite Structures.
  • Surface Coatings Technology.