Thermal Resistance of Microelectronic Packages. Part 1. Recommended Method 1012 (Thermal Characteristics) for MIL-STD-883. Part 2. Summary of Analyses and Experimental Data for Thermal Test Packages and MIL-M-38510 Packages.
Abstract
Methods for measurement of thermal resistance and response curves, including MIL-STD-883 Method 1012, were evaluated to determine an optimum method to measure MIL-M-38510 packages. Computer simulation, IR and electrical measurements were evaluated and compared for special thermal test packages. A ratio of about 5:1 was shown to exist for the junction peak, average and region temperature rise. Measurements can be misleading without proper interpretation. The optimum method, IR measurement of a coated chip, can measure only the junction region thermal resistance.
Document Details
- Document Type
- Technical Report
- Publication Date
- Aug 01, 1975
- Accession Number
- ADA017444
Entities
People
- Gene K. Baxter
- J. Walter Brouillette
Organizations
- General Electric