Basic Adhesion Mechanisms in Thick and Thin Films.

Abstract

During this quarter, the adhesion strengths between preglazed ceramic substrates and metal foils of gold, silver, and copper were measured. In addition, the adhesion strengths of gold and silver model inks were determined using a two-level method of application, i.e., sequential depositions of glass and metal inks with a preglazing step prior to firing the metal deposit. By comparing the total sintered metal adhesion strength with the chemically derived strength from the foil-glaze measurements, it was possible to ascertain the microstructural contribution. Variations in surface bondability were observed in both gold and silver after prolonged firing and/or at excessively high temperatures. This variation was consistent with the wetting and spreading results of E1527 glass on gold and silver presented in the last quarterly report. Chemical analyses of the commercial copper and silver inks are presented.

Document Details

Document Type
Technical Report
Publication Date
Oct 31, 1975
Accession Number
ADA017788

Entities

People

  • Kenneth R. Bube
  • Thomas T. Hitch

Organizations

  • RCA Corporation

Tags

DTIC Thesaurus Topics

  • Adhesion
  • Chemical Analysis
  • Films
  • High Temperature
  • Measurement
  • Thin Films

Readers

  • Computational Modeling and Simulation
  • Surface Coatings Technology.
  • Surface Engineering/Surface Coating Technology.