Deformation Substructure of Copper Single Crystals After Explosive Loading as Disclosed by Electron-Optical and X-Ray methods,

Abstract

Compressively shock-loaded copper single crystals were examined employing complementary methods of X-ray diffraction, X-ray topography (XRT), transmission electron microscopy (TEM) and scanning electron microscopy (SEM). The defect structures induced depended on the crystal orientation relative to the direction of shock propagation and also upon the existence or absence of a reflected tensile wave. TEM disclosed that the defect structure induced by compressive shock loading consisted of clusters of microtwins alternating with a tangled dislocation substructure. Failure zones did not occur. The induced defect structure exhibited a low net macroscopic misorientation which amounted to less than two degrees of arc and the misorientation of the twinned regions with respect to the adjacent dislocation substructure was less than 1/2 degree of arc. By contrast specimens subjected to a reflected tensile pulse exhibited a failure zone and the defect structure in its vicinity showed a substantial macroscopic misorientation. In addition, a high incidence of porosity was observed by SEM. The pores had octahedral shape with facets corresponding to close-packed planes. Structural details observed within the pores were identified as twinned regions. (Author)

Document Details

Document Type
Technical Report
Publication Date
Oct 01, 1975
Accession Number
ADA018136

Entities

People

  • Mingxing Chen
  • P. W. Kingman
  • S. Weissmann
  • V. A. Greenhut

Organizations

  • Ballistic Research Laboratory

Tags

Communities of Interest

  • Air Platforms

DTIC Thesaurus Topics

  • Crystals
  • Diffraction
  • Dislocations
  • Electron Microscopy
  • Electrons
  • Microscopy
  • Scanning Electron Microscopy
  • Single Crystals
  • Transmission Electron Microscopy
  • X Rays
  • X-Ray Diffraction

Fields of Study

  • Materials science

Readers

  • Materials Science and Engineering.
  • Mechanical Engineering/Mechanics of Materials.

Technology Areas

  • Microelectronics