Thermal Analysis of the RFSS Switch Driver.
Abstract
Overheated microelectronic circuits caused some equipment failures in a device known as the RFSS switch driver. A thermal analysis was made of this equipment using the CINDA computer code, and the mathematical model was validated by thermocouple readings. The effect of package material and the effect of convective cooling fins were calculated and the results are presented in graphic form. Recommendations are made for improving the dissipation of heat.
Document Details
- Document Type
- Technical Report
- Publication Date
- Sep 18, 1975
- Accession Number
- ADA018170
Entities
People
- Vernon A. Nieberlein