AN/URC-78(XE-2)/V Radio Set. Microelectronics and Module Design Plan.
Abstract
The design plan describes the approach to be used in fabricating the microelectronic portions of Radio Set AN/URC-78(XE-2)/V. The circuitry for the URC-78 will consist of monolithic microcircuits and discrete semiconductor components mounted on thick-film hybrid substrates. The same substrates will also carry discrete passive components where necessary. These circuit modules are the primary subject of the design plan. The plan describes the philosophy of monolithic and thick-film hybrid microelectronics as implemented by RCA and proposed for the URC-78 program. The fabrication techniques used to produce the ceramic thick-film hybrid substrates, assemble the discrete and monolithic components on the substrates, and assemble the ceramic substrates into equipment modules, are presented. Reliability is predicted for these modules, and the background data is given which justifies the choice of the selected microelectronics techniques.
Document Details
- Document Type
- Technical Report
- Publication Date
- Dec 17, 1971
- Accession Number
- ADA020431