Resistance of Diffusion-Bonded Electroless Nickel-Plated Ti-5Al-2.5Sn Alloy to Hot Salt Stress Corrosion Cracking
Abstract
Bent-beam, constant deflection experiments at a temperature of 900 F for time durations up to 1000 hours indicated that diffusion-bonded (950 F or 1150 F in vacuum) electroless nickel plate was affected by hot salt stress corrosion (HSSC). However, the protective plate demonstrated potential for reducing the susceptibility of the Ti-5Al-2.5Sn titanium alloy substrate to HSSC cracking. Mechanically induced surface defects (indentations, scratches) in the surface of the plate did not significantly alter the patterns of corrosion attack. Continued in-house efforts to establish failure mechanisms and to optimize plating processes are contingent upon results from further tests to determine erosion and fatigue behavior of these materials at elevated temperature.
Document Details
- Document Type
- Technical Report
- Publication Date
- Dec 01, 1975
- Accession Number
- ADA020940
Entities
People
- Anthony K. Wong
- Joseph L. Morrossi
- Milton Levy
Organizations
- United States Army Research Laboratory