Manufacturing Methods and Technology Program for Beam Lead Sealed Junction Semiconductor Devices.

Abstract

The accomplishments of the first quarter in Motorola's effort on the USA ECOM Manufacturing Methods and Technology beam lead device program are presented herein. Much effort has been expended in evaluating each device to determine the best approach for meeting the yield and production goals of the program. On many devices this effort is completed and reported in detail. Other devices are presented in outline form because the evaluation is not complete enough for full reporting, even though much time and effort is being expended on them. (Author)

Document Details

Document Type
Technical Report
Publication Date
Aug 01, 1975
Accession Number
ADA021322

Entities

People

  • Art Peltier
  • Dan Zobel
  • Mike Crabtree

Organizations

  • Motorola Mobility

Tags

DTIC Thesaurus Topics

  • Beam Leads
  • Compound Semiconductors
  • Electronics
  • Manufacturing
  • Production
  • Semiconductor Devices
  • Semiconductor Manufacturing
  • Semiconductors
  • Solid State Electronics
  • Test And Evaluation

Readers

  • Applied Combinatorial Optimization and Logic Circuit Design.
  • Semiconductor Device Technology
  • Technical Research and Report Writing.

Technology Areas

  • Microelectronics