Grounding, Bonding, and Shielding Practices and Procedures for Electronic Equipments and Facilities. Volume II. Procedures for Facilities and Equipments.

Abstract

This three volume series sets forth a set of grounding, bonding, and shielding principles and practices for electronic equipments and facilities. In Volume 2, the principles and theories are reduced to practical steps and procedures for use in equipment and facility development. Assembly and construction, installation and checkout, and maintenance for long term use are emphasized in this Volume.

Document Details

Document Type
Technical Report
Publication Date
Dec 01, 1975
Accession Number
ADA022608

Entities

People

  • H. W. Denny
  • J. A. Woody

Organizations

  • Georgia Tech

Tags

DTIC Thesaurus Topics

  • Assembly
  • Construction
  • Construction Equipment
  • Electronic Equipment
  • Maintenance
  • Shielding

Fields of Study

  • Physics

Readers

  • Aerospace Test and Evaluation
  • Business Analytics
  • Theoretical Analysis.

Technology Areas

  • Microelectronics