Grounding, Bonding, and Shielding Practices and Procedures for Electronic Equipments and Facilities. Volume III. Economic Considerations and Program Management.

Abstract

The three volume series sets forth a set of grounding, bonding, and shielding principles and practices for electronic equipments and facilities. Volume III considers the interrelationship between grounding, bonding, and shielding and other elements of the facility or equipment development cycle.

Document Details

Document Type
Technical Report
Publication Date
Dec 01, 1975
Accession Number
ADA022871

Entities

People

  • H. W. Denny
  • S. L. Robinette

Organizations

  • Georgia Tech

Tags

DTIC Thesaurus Topics

  • Electronic Equipment
  • Program Management
  • Shielding

Readers

  • Aerospace Test and Evaluation
  • Life Cycle Cost Analysis

Technology Areas

  • Microelectronics