Manufacturing Methods and Technology Program for Beam Lead Sealed Junction Semiconductor Devices.

Abstract

The object of the study is to refine the processes required to fabricate beam-lead sealed junction devices in production quantities by manufacturing methods. A detailed evaluation is included on most devices not discussed in the First Quarterly Report. The status of all devices presently in design or processing is reviewed.

Document Details

Document Type
Technical Report
Publication Date
Nov 21, 1975
Accession Number
ADA023846

Entities

People

  • Art Peltier
  • Don Zobel
  • Joe Wise
  • Mike Crabtree

Organizations

  • Motorola Mobility

Tags

Communities of Interest

  • Materials and Manufacturing Processes

DTIC Thesaurus Topics

  • Beam Leads
  • Compound Semiconductors
  • Electronics
  • Manufacturing
  • Production
  • Semiconductor Devices
  • Semiconductor Manufacturing
  • Semiconductors
  • Solid State Electronics
  • Test And Evaluation

Readers

  • Integrated Circuit Design and Technology.
  • Systems Analysis and Design
  • Technical Research and Report Writing.

Technology Areas

  • Microelectronics