Mechanisms of Adhesion Failure Between Polymers and Metallic Substrates. Part 2. Aluminum 2024-T3 and Titanium 6Al4V with HT424 Adhesive

Abstract

This report describes the continuation of a study of aluminum 2024-T3 alloy and titanium 6Al-4V alloy adherends, adhesively bonded with epoxy HT424 adhesive. The adherend surface properties, after standard preparation treatments, were characterized with a number of surface tools; Ellipsometry, surface potential difference (SPD), Auger electron spectroscopy (AES), electron, scanning electron and optical microscopy, contact angle, photo electron emission, and light scattering. A study was made of bond strengths after FPL etching and phosphoric acid anodizing and after aging of these surfaces in water vapor and in water. By calibrating the above mentioned instruments for hydroxide and organic films of known chemistry, it has been possible to discern the mechanism of aging degradation. The mechanisms of bond failure have been greatly ellucidated by a careful study of the data. Suggestions are given to improve bond strength and stability based upon the analysis.

Open PDF

Document Details

Document Type
Technical Report
Publication Date
Oct 01, 1975
Accession Number
ADA025256

Entities

People

  • Tennyson Smith

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Aluminum Oxides
  • Chemical Synthesis
  • Chemistry
  • Crystal Structure
  • Electron Emission
  • Fatty Acids
  • Laboratory Equipment
  • Materials
  • Materials Laboratories
  • Materials Processing
  • Materials Science
  • Materials Testing
  • Photoexcitation
  • Refractive Index
  • Surface Finishing
  • Surface Properties
  • Surface Roughness

Fields of Study

  • Materials science

Readers

  • Materials Science and Engineering.
  • Surface Coatings Technology.
  • Systems Analysis and Design

Technology Areas

  • Microelectronics
  • Microelectronics - Graphene