Scanning Electron Microscopy, Ion Scattering and Secondary Ion Mass Spectrometry to Characterize Apparent 'Adhesive' Failure in an Adhesive Bond.

Abstract

Frequently it is not easy using visual or even microscopic examination of an adhesive joint to determine after physical testing whether an apparent adhesive failure occurred at the original interface due to improper wetting or at some new interface leaving behind a thin layer of adhesive. Elemental analysis techniques such as ion scattering spectrometry (ISS) and secondary ion mass spectrometry (SIMS) combined with Scanning Electron Microscopy (SEM) are capable of determining the locus of failure in an adhesive joint. The use of ISS and SIMS in combination is shown for investigating adhesive bonding phenomena. The operating parameters as well as advantages and disadvantages of each are summarized. ISS-SIMS data are shown for two adherend surfaces which broke in a lap shear test by apparent cohesive failure in both the adhesive and adherend. Data are also shown for failure surfaces from peel test and thin adherend double cantilever beam (wedge test) specimens. (Author)

Document Details

Document Type
Technical Report
Publication Date
Mar 01, 1976
Accession Number
ADA025615

Entities

People

  • W. L. Baun

Organizations

  • Air Force Research Laboratory

Tags

DTIC Thesaurus Topics

  • Adhesive Bonding
  • Adhesives
  • Cantilever Beams
  • Electron Microscopy
  • Electrons
  • Joints
  • Mass Spectrometry
  • Microscopy
  • Scanning
  • Scanning Electron Microscopy
  • Scattering
  • Shear Tests
  • Spectrometry
  • Spectroscopy

Readers

  • Surface Coatings Technology.
  • Thin Film Deposition Science.

Technology Areas

  • Microelectronics