Radiation Effects in MOS Gate Insulators.

Abstract

Metal-alumina-silicon structures were made by a CVD process. Comparison with reported data on MAS devices prepared in industrial laboratories indicate that the latter samples consistently exhibit significantly lower initial charge, higher charge injection thresholds, and lower injected charge densities. Photodepopulation measurements of electrons injected under high positive bias indicated that some of the electron traps were associated with residual water generated in the CVD process and therefore might be minimized by some post-deposition process. The effect of Gamma-irradiation up to 10 to the 7th power rads (under floating gate conditions) of thin MOS structures with aluminum or chromium metallization was determined by changes in the fixed charge or interface state density. Chemical micro-analyses and C-V measurements were combined to determine the role of sodium and of aluminum in the mobile charges observed in MOS gate insulators by 300C bias stress treatments, before and after exposure to 10 to the 6th power rads of ionizing radiation from a 60Co source.

Document Details

Document Type
Technical Report
Publication Date
Sep 01, 1975
Accession Number
ADA026017

Entities

People

  • Frederick M. Fowkes
  • Sidney R. Butler
  • Walter E. Dahlke

Organizations

  • Lehigh University

Tags

Communities of Interest

  • Energy and Power Technologies
  • Materials and Manufacturing Processes

DTIC Thesaurus Topics

  • Aluminum
  • Buildings And Structures
  • Charge Density
  • Corpuscular Radiation
  • Dielectrics
  • Electrons
  • Ionizing Radiation
  • Measurement
  • Metals
  • Nuclear Radiation
  • Radiation
  • Radiation Effects

Readers

  • Nuclear and Radiation Engineering.
  • Semiconductor Device Technology
  • Thin Film Deposition Science.

Technology Areas

  • Microelectronics
  • Microelectronics - Graphene