Manufacturing Methods and Technology Program for Beam Lead Sealed Junction Semiconductor Devices.

Abstract

The object of the study is to refine the processes required to fabricate beam-lead sealed junction devices in production quantities by manufacturing methods. Considerable progress was made during the third quarter of the program. A number of different types of discretes and integrated circuits were delivered. Some of the past problems have been resolved, but the real challenge is still the discretes with their differing processing profiles. This report reviews the activities along with the present status of most of the devices. The tri-metallization process is reviewed in detail.

Document Details

Document Type
Technical Report
Publication Date
Feb 01, 1976
Accession Number
ADA026749

Entities

People

  • Dale Buhanan
  • Frank Mcmillan
  • Joe Wise

Organizations

  • Motorola Mobility

Tags

Communities of Interest

  • Materials and Manufacturing Processes

DTIC Thesaurus Topics

  • Beam Leads
  • Circuits
  • Compound Semiconductors
  • Electronics
  • Integrated Circuits
  • Manufacturing
  • Metal Oxide Semiconductors
  • Production
  • Semiconductor Devices
  • Semiconductor Manufacturing
  • Semiconductors
  • Solid State Electronics

Fields of Study

  • Engineering

Readers

  • Integrated Circuit Design and Technology.
  • Systems Analysis and Design

Technology Areas

  • Microelectronics