Basic Adhesion Mechanisms in Thick and Thin Films.
Abstract
Work on the fundamental wetting and sintering processes was continued, so that comparisons could be made among Au, Ag, Cu, Pt, and Pd. Metal powder sintering rate studies in the presence and absence of E1527 glass were completed for Pt and Pd and showed no increase in densification with glass present. Only Ag densification is enhanced in the presence of glass, while Pt, Pd, Cu and Au experience some retrograde sintering (swelling). Electrical resistivity ratios, R(300 K)/R(77 K), were determined for layered Au metallization on alumina, glaze, and CuO-doped glaze surfaces after firing at 500, 750, and 900C. Similar resistivity ratio tests were performed on layered 75 Au-25 Pt (wt pct) metallization to determine the degree of alloying as a function of firing temperature. The x-ray fluorescence spectrometric (XRFS) analysis of 21 commercial Au-Pt and Au-Pt-Pd fired conductor films were completed.
Document Details
- Document Type
- Technical Report
- Publication Date
- Jul 30, 1976
- Accession Number
- ADA028880
Entities
People
- Kenneth R. Bube
- Thomas T. Hitch
Organizations
- RCA Corporation