Manufacturing Methods and Technology Program for Beam Lead Sealed Junction Semiconductor Devices.

Abstract

The object of this study is to refine the processes required to fabricate beam-lead sealed junction devices in production quantities by manufacturing methods. The quarter has seen major advances in minority lifetime control, control of surface leakage, photo masking techniques, and control of surface states.

Document Details

Document Type
Technical Report
Publication Date
May 21, 1976
Accession Number
ADA028938

Entities

People

  • Dale Buhanan
  • Frank Mcmillan
  • Joe Wise

Organizations

  • Motorola Mobility

Tags

Communities of Interest

  • Materials and Manufacturing Processes

DTIC Thesaurus Topics

  • Beam Leads
  • Compound Semiconductors
  • Electronics
  • Manufacturing
  • Minority Groups
  • Production
  • Semiconductor Devices
  • Semiconductor Manufacturing
  • Semiconductors
  • Solid State Electronics

Readers

  • Integrated Circuit Design and Technology.
  • Metallurgy
  • Quantum Dot Semiconductor Device Photonics and Graphene Optoelectronic Materials and THz Physics.

Technology Areas

  • Microelectronics
  • Microelectronics - Graphene