Semiconductor Measurement Technology

Abstract

Contents: Resistivity; Physical analysis methods; Test structure applications; Materials and procedures for wafer processing; Photolithography; Test patterns; Interconnection bonding; Hermeticity; Device inspection and test; Thermal properties of devices; References.

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Document Details

Document Type
Technical Report
Publication Date
Oct 01, 1976
Accession Number
ADA032167

Entities

People

  • W. Murray Bullis

Organizations

  • National Institute of Standards and Technology

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Chemical Synthesis
  • Chemistry
  • Crystal Structure
  • Detectors
  • Dye Lasers
  • Lasers
  • Mass Spectrometry
  • Materials
  • Materials Science
  • Measurement
  • P-N Junctions
  • Pull Tests
  • Semiconductor Devices
  • Semiconductors
  • Spectra
  • Spectrometry
  • Test And Evaluation

Readers

  • Aerospace Test and Evaluation
  • Software Engineering
  • Thin Film Deposition Science.

Technology Areas

  • Microelectronics
  • Microelectronics - Graphene