Production Engineering Measures to Manufacture Super Fine Finish Beryllia.
Abstract
A progressive polishing process was developed to reduce the roughness of the working surface of beryllia substrates to less than four microinches center line average. Commercially avialable 1 inch x 1 inch and 2 inch x 2 inch beryllia plates containing 99.5 percent beryllia served as the input material. To minimize warpage, one face of the beryllia plate was machined on a polishing wheel charged with six micron diamond paste. The opposite or working surface was polished on the same wheel to a surface finish of 5-8 microinches. The cleaned working surface was final polished on a polishing wheel charged with three micron diamond paste. Scale-up from a twelve inch diameter laboratory polisher to a twenty-four inch diameter manufacturing unit was demonstrated. Dicing was used to produce small 0.080 inch x 0.110 inch substrates from polished 1.0 inch x 1.0 inch plates. A Pilot Run demonstration achieved the production rate goal of 1000 substrates per week for each of three sizes of beryllia substrates. (Author)
Document Details
- Document Type
- Technical Report
- Publication Date
- Oct 12, 1976
- Accession Number
- ADA032433
Entities
People
- Kenneth A. Walsh