Basic Adhesion Mechanisms in Thick and Thin Films.
Abstract
The study concentrated on improving understanding of thick-film conductors of the Au-Pt class. The work is divided into two categories - commercial ink studies and model ink (RCA-formulated material) studies. In the model ink studies section, data are presented on solder wettability for combinations of individually printed frit and metal layers as a function of metal layer alloy composition, frit composition, print thickness, and firing time and temperature. Adhesion data obtained with a tensile mode solder adhesion test are presented for some of these combinations. Extensive adhesion data were taken on six selected commercial ink materials fired onto two alumina substrate types (96 and 99.5 wt pct purities). The data presented represent films prepared by matrices of process variations and stressed with environmental conditions known to degrade Au-Pt materials.
Document Details
- Document Type
- Technical Report
- Publication Date
- Oct 31, 1976
- Accession Number
- ADA033528
Entities
People
- Kenneth R. Bube
- Thomas T. Hitch
Organizations
- RCA Corporation