Manufacturing Methods and Technology Program for Beam Lead Sealed Junction Semiconductor Devices.

Abstract

Yields on 5400 and 54LS integrated circuits continue to improve as predicted. The exception is on a few lots where equipment problems or errors resulted in unsatisfactory results. Designs and design changes are reviewed on all of the integrated circuits. Yields on the discrete devices are still discouraging. However, the basic designs are good; only processing variations are of concern. It is believed that yields will improve as additional lots are processed during the confirmatory phase. (Author)

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Document Details

Document Type
Technical Report
Publication Date
Aug 01, 1976
Accession Number
ADA033591

Entities

People

  • Dale Buhanan
  • Frank Mcmillan
  • Joe Wise

Organizations

  • Motorola Mobility

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Accumulators
  • Beam Leads
  • Ceramic Materials
  • Circuits
  • Contracts
  • Diodes
  • Electronics Industry
  • Engineering
  • High Temperature
  • Integrated Circuits
  • Manufacturing
  • Materials
  • Metals
  • Modules (Electronics)
  • Schottky Diodes
  • Semiconductor Devices
  • Semiconductors

Readers

  • Adaptive Control and Estimation with Uncertainty in Dynamic Systems.
  • Electronics Engineering
  • Theoretical Analysis.

Technology Areas

  • Microelectronics