The Dynamic Measurement and Functional Inspection of Solder Joints.

Abstract

The study evaluated the effectiveness of nondestructive and dynamic measurement techniques for determining the quality and reliability of solder joints when compared to the presently used method of visually inspecting solder joints for cosmetic appearance. The study concludes that inspection cost can be reduced and the reliability of solder joints can be best assured by quantitatively controlling soldering processes.

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Document Details

Document Type
Technical Report
Publication Date
Dec 15, 1976
Accession Number
ADA034852

Entities

Organizations

  • Lockheed Martin

Tags

Communities of Interest

  • Materials and Manufacturing Processes

DTIC Thesaurus Topics

  • Inspection
  • Joints
  • Measurement
  • Reliability

Fields of Study

  • Engineering

Readers

  • Electrical Engineering
  • Structural Health Monitoring of Composite Structures.
  • Systems Analysis and Design