Thermal Neutron Damage in Bipolar PNP Transistors.

Abstract

An experimental test was made of the hypothesis that the source of thermal neutron damage in bipolar PNP transistors is the result of thermal neutron captures by the Boron 10 present in the emitter region of the transistors. Transistors were specifically made using three different ratios of Boron 10 to Boron 11 as the emitter dopant material, and in four different geometries. Forty-two of these specially made transistors were exposed to thermal neutron fluences as high as approximately 5 x 10 to the 15th power neutrons per square centimeter. In each case the damage observed corresponded to the fraction of Boron 10 to total boron used as the emitter dopant material, thus confirming the hypothesized damage mechanism. The dependence of the collector current, thermal neutron fluence, and emitter-base geometry on the observed gain degradation also indicated that bulk damage is responsible for thermal neutron damage in PNP transistors. Some devices were also irradiated in a fast neutron environment. Fast neutrons were found to be approximately one hundred times more effective than thermal neutrons in producing damage in the devices that use a naturally occurring ratio of Boron 10 to Boron 11 in the emitter. (Author)

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Document Details

Document Type
Technical Report
Publication Date
Dec 01, 1976
Accession Number
ADA034881

Entities

People

  • Timothy D. Stanley

Organizations

  • Air Force Institute of Technology

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Air Force
  • Alpha Particles
  • Bipolar Junction Transistors
  • Charge Carriers
  • Charged Particles
  • Crystal Lattices
  • Crystal Structure
  • Fast Neutrons
  • Gamma Rays
  • Ionizing Radiation
  • Materials
  • Measurement
  • Neutron Capture
  • Neutron Reactions
  • Nuclear Reactors
  • Pnp Transistors
  • Thermal Neutrons

Fields of Study

  • Physics

Readers

  • Semiconductor Device Technology
  • Structural Health Monitoring of Composite Structures.