Proceedings of the ECOM Hybrid Microcircuit Symposium, 1976

Abstract

Papers discuss application of hybrid microcircuits in Army communication and surveillance and other military and government equipment. Hybrid Microcircuit process and quality control documents and guides are described and qualification requirements for thick film networks and epoxy adhesives defined. Automation of a hybrid microcircuit line, non-wire bonding techniques, ruggedization and standard electronic modules are detailed.

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Document Details

Document Type
Technical Report
Publication Date
Jun 01, 1976
Accession Number
ADA035246

Entities

People

  • Isaac H. Pratt
  • Owen P. Layden

Organizations

  • United States Army Communications-Electronics Command

Tags

Communities of Interest

  • Advanced Electronics
  • Ground and Sea Platforms

DTIC Thesaurus Topics

  • Chemistry
  • Circuit Testers
  • Control Systems
  • Electronics Industry
  • Electronics Laboratories
  • Fabrication
  • Failure Mode And Effect Analysis
  • Integrated Circuits
  • Materials
  • Materials Laboratories
  • Modules (Electronics)
  • Radio Equipment
  • Semiconductor Devices
  • Semiconductors
  • Test And Evaluation
  • Test Equipment
  • Transducers

Readers

  • Software Engineering
  • Surface Coatings Technology.

Technology Areas

  • Microelectronics
  • Microelectronics - Graphene