Automatic Assembly of Hybrid Circuits on a Ceramic Substrate.

Abstract

A system was developed to mass produce thick-film hybrid integrated circuits on ceramic substrate. This technology was tested successfully with the production of 3000 XM734 multioption fuze amplifier assemblies. The high-volume, continuous production applies to military environments and incorporates high component density. Nonrecurring costs in capital equipment and minimal labor are among the major economic advantages. (Author)

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Document Details

Document Type
Technical Report
Publication Date
Dec 01, 1976
Accession Number
ADA035276

Entities

People

  • Aaron A. Miller
  • J. G. F. Bouchard

Organizations

  • Harry Diamond Laboratories

Tags

Communities of Interest

  • Advanced Electronics
  • Weapons Technologies

DTIC Thesaurus Topics

  • Assembly
  • Automation
  • Circuits
  • Contracts
  • Control Systems
  • Electronics
  • Electronics Laboratories
  • Engineering
  • Films
  • Hybrid Circuits
  • Manufacturing
  • Mass Production
  • Microcircuits
  • Production
  • Production Rate
  • Semiconductors
  • Thick Films

Readers

  • Life Cycle Cost Analysis
  • Software Engineering
  • Surface Engineering/Surface Coating Technology.