Interface States in Schottky Barrier Diodes.

Abstract

Gallium arsenide Schottky barrier junctions have become increasingly important in a wide variety of high performance GaAs microwave devices such as IMPATT diodes, Schottky gate FETs and RF detectors. Although neutron irradiation effects on silicon Schottky barrier junctions are well documented no detailed results have been reported for GaAs Schottky junctions. The purpose of this program was to explore the effect of fast neutron irradiation on the metal semiconductor interface and the resultant performance of Schottky barrier (including with transient ionizing radiation). Device changes at neutron fluences where the reduction in free carrier concentration is less than 20% were emphasized, as larger reductions in free carrier concentration l lead to gross changes in junction properties that cannot be tolerated in most applications. Gold and aluminum were selected as the metals for forming the Schottky junctions since there is a large variety of results for Au-GaAs Schottky junctions reported in the literature, which could be used for comparison purposes, and because the Al-GaAs junction has a lower barrier height and appears to be more stable than the Au-GaAs interface.

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Document Details

Document Type
Technical Report
Publication Date
Aug 01, 1976
Accession Number
ADA035720

Entities

People

  • Jose M. Borrego
  • Ronald J. Gutmann
  • S. Ashok

Organizations

  • Rensselaer Polytechnic Institute

Tags

Communities of Interest

  • Advanced Electronics
  • Space
  • Weapons Technologies

DTIC Thesaurus Topics

  • Detectors
  • Electronics Industry
  • Electronics Laboratories
  • Fast Neutrons
  • Field Emission
  • Impatt Diodes
  • Ionizing Radiation
  • Jet Propulsion
  • Materials
  • Metal-Semiconductor Junctions
  • Navy
  • Radiation Effects
  • Schottky Diodes
  • Semiconductors
  • Systems Engineering
  • Test And Evaluation
  • Test Facilities

Fields of Study

  • Materials science

Readers

  • Electronics Engineering
  • Nuclear and Radiation Engineering.
  • Thin Film Deposition Science.

Technology Areas

  • Microelectronics