Evaluation of Procedures in Automated Residual Stress Measurements.

Abstract

The measurement of residual stress by the X-ray diffraction technique involves determining the lattice spacing of a crystallographic plane at different inclinations of the sample and relating the change in the spacing to a stress on the surface of the specimen. The sources of error in determining the residual stress are investigated in this report. A short review of the fundamental principles of the measurement is given. The important instrumental and geometric factors contributing to errors in the measured stress are presented. To account for random errors in the data accumulation on the measured stress, a complete statistical analysis based on a least-squares parabola is given.

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Document Details

Document Type
Technical Report
Publication Date
Feb 10, 1977
Accession Number
ADA036127

Entities

People

  • Jerome B. Cohen
  • Michael R. James

Organizations

  • Northwestern University

Tags

Communities of Interest

  • Air Platforms
  • Ground and Sea Platforms

DTIC Thesaurus Topics

  • Accuracy
  • Computer Programs
  • Crystal Structure
  • Curve Fitting
  • Detectors
  • Diffraction
  • Diffractometers
  • Geometry
  • Materials
  • Materials Science
  • Measurement
  • New York
  • Scattering
  • Statistical Analysis
  • United States
  • X Rays
  • X-Ray Diffraction

Readers

  • Materials Science and Engineering.
  • Mechanical Engineering/Mechanics of Materials.
  • Theoretical Analysis.

Technology Areas

  • Space