Oxide Barriers on GaAs by Neutralized Ion Beam Sputtering

Abstract

Tantalum and silicon oxides have been sputter deposited onto gallium arsenide using a 500 eV beam of neutralized argon atoms. MIS devices show very low leakage and capacitances that can be varied from full accumulation to depletion with the application of modest voltages. Other measurements (breakdown field, dielectric constant, adherence, Auger profile, and photoluminescence) also suggest that these structures hold potential usefulness for insulated gate GaAs circuitry.

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Document Details

Document Type
Technical Report
Publication Date
Feb 10, 1977
Accession Number
ADA037243

Entities

People

  • J. R. Sites
  • L. G. Meiners
  • R. C. Pan

Organizations

  • Colorado State University

Tags

DTIC Thesaurus Topics

  • Adhesion
  • Dielectric Permittivity
  • Dielectrics
  • Electronics
  • Electronics Laboratories
  • Fabrication
  • Gallium
  • Gallium Arsenides
  • Ion Beams
  • Materials Processing
  • Measurement
  • Mechanical Properties
  • Semiconductors
  • Stainless Steel
  • Tantalum
  • Thickness
  • Wear Resistance

Fields of Study

  • Materials science

Readers

  • Semiconductor Device Technology

Technology Areas

  • Microelectronics
  • Microelectronics - Graphene