Hybrid Integrated Circuits: A Survey.

Abstract

Two proximity fuzes under development at the Harry Diamond Laboratories use thick-film hybrid integrated circuits. A survey of the hybrid integrated circuit industry was conducted to determine its capability to produce these circuits in volume within the continental United States. The circuits as complex as those used in XM587 and XM734 fuzes are in volume production using certain types of automation. (Author)

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Document Details

Document Type
Technical Report
Publication Date
Jan 01, 1977
Accession Number
ADA038010

Entities

People

  • Philip Ingersoll

Organizations

  • Harry Diamond Laboratories

Tags

Communities of Interest

  • Advanced Electronics
  • Weapons Technologies

DTIC Thesaurus Topics

  • Amplifiers
  • Automatic
  • Automation
  • Circuits
  • Contractors
  • Contracts
  • Electronics
  • Engineering
  • Fabrication
  • Ignition Systems
  • Integrated Circuits
  • Manufacturing
  • Procurement
  • Production
  • Production Rate
  • Semiconductor Manufacturing
  • United States

Readers

  • Business Analytics
  • Integrated Circuit Design and Technology.
  • Logistics and Supply Chain Management.