Manufacturing Methods and Technology Engineering High Efficiency, High Power Gallium Arsenide Read-Type IMPATT Diodes.
Abstract
Work on fabrication of the Confirmatory Samples was initiated. The X and Ku-band wafers were grown. The processing of dice from these wafers was begun. New equipment has been installed on the production line. A hot-gas bonding unit was installed to facilitate chip mounting. A thermal resistance tester was installed to increase production rates. (Author)
Document Details
- Document Type
- Technical Report
- Publication Date
- Oct 01, 1976
- Accession Number
- ADA038172
Entities
People
- Henri R. Chalifour
- Samuel R. Steele
Organizations
- RTX