The Effects of Substrate Composition of Thick Film Circuit Reliability.

Abstract

Studies of the rate of the dissolution of 96% Al2O3 substrates (AlSiMag 614) in a model glass (70% PbO, 20% B2O3, 10% SiO2) were conducted as a function of temperature from 750 to 1000 C. The rate limiting steps were found to be phase boundary reaction rate control at short times and diffusion through a boundary layer under natural convection at longer times. The rate equations developed from the experimental data allow the prediction of the total quantity of substrate dissolved in the resistor glass under any processing conditions.

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Document Details

Document Type
Technical Report
Publication Date
Feb 28, 1977
Accession Number
ADA038340

Entities

People

  • R. W. Vest

Organizations

  • Purdue University

Tags

Communities of Interest

  • Advanced Electronics
  • Air Platforms
  • Energy and Power Technologies

DTIC Thesaurus Topics

  • Acids
  • Arrhenius Equation
  • Chemical Analysis
  • Chemical Synthesis
  • Chemistry
  • Electrical Properties
  • Electron Microscopy
  • Film Resistors
  • Filtration
  • Geometry
  • Grain Size
  • Indicator Dyes
  • Materials
  • Materials Engineering
  • Particles
  • Resistance
  • Scattering

Readers

  • Combustion science or combustion engineering.
  • Fluid Dynamics.
  • Thin Film Deposition Science.