Manufacturing Methods and Technology Program for Beam Lead Sealed Junction Semiconductor Devices.

Abstract

Because of the number of integrated circuits processed to date, along with the favorable probe yield results, the 5400 and 54LS processes have been well established. Results on the discrete devices, however, have not been as promising. Additional lots of each device type are being processed in an attempt at further improving yields. Packages for all of the devices have been designed for use in satisfying the qualification test requirements. (Author)

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Document Details

Document Type
Technical Report
Publication Date
Nov 01, 1976
Accession Number
ADA038681

Entities

People

  • Bill Armbruster
  • Dale Buhanan
  • Gerhart Zenner
  • Jim Parch
  • Joe Wise

Organizations

  • Motorola Mobility

Tags

DTIC Thesaurus Topics

  • Accumulators
  • Beam Lead Technology
  • Beam Leads
  • Circuits
  • Computer Programs
  • Contracts
  • Electronics
  • Engineering
  • Failure Mode And Effect Analysis
  • Integrated Circuits
  • Manufacturing
  • Materials
  • Production
  • Semiconductor Devices
  • Semiconductors
  • Specifications
  • Standards

Readers

  • Quantum Dot Semiconductor Device Photonics and Graphene Optoelectronic Materials and THz Physics.
  • Software Engineering
  • Systems Analysis and Design

Technology Areas

  • Microelectronics
  • Microelectronics - Graphene