Multichip Technology - A Method of Increasing the Packing Density While Simultaneously Decreasing the Assembly Expense

Open PDF

Document Details

Document Type
Technical Report
Publication Date
Nov 08, 1976
Accession Number
ADA039070

Entities

People

  • H. J. Hanke

Organizations

  • National Air and Space Intelligence Center

Tags

Communities of Interest

  • Air Platforms

DTIC Thesaurus Topics

  • Air Force
  • Assembly
  • Circuit Boards
  • Circuits
  • Computers
  • Cost Reductions
  • Costs
  • East Germany
  • Foreign Technology
  • Germany
  • Manufacturing
  • Mass Production
  • Packing Density
  • Printed Circuit Boards
  • Printed Circuits
  • Production
  • Semiconductors