Low RF Loss Metal-Ceramic Bonds.

Abstract

This report covers the results of an investigation of a technological process for the production of consistent bonds between metal and ceramic components for use in the rf circuit of high power microwave devices. Sputter metallization of the ceramic components with the incorporation of a thin active titanium metal layer comprises the basic process. Special attention was placed on surface smoothness and contamination of the metallization. No heat barrier at the metal-ceramic interfaces was found. Also, low rf losses were realized.

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Document Details

Document Type
Technical Report
Publication Date
Nov 01, 1976
Accession Number
ADA039334

Entities

People

  • Robert E. Russell

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Body Weight
  • Chemical Analysis
  • Chemistry
  • Electron Microscopes
  • Energy
  • Failure Mode And Effect Analysis
  • Heat Transfer
  • High Temperature
  • Mass Spectrometers
  • Materials
  • Materials Science
  • Materials Testing
  • Measurement
  • Phase Diagrams
  • Tensile Strength
  • Thermal Conductivity
  • Thin Films

Readers

  • Microwave Engineering.
  • Nanofabrication and Microfabrication.
  • Thin Film Deposition Science.

Technology Areas

  • Directed Energy
  • Directed Energy - Pulsed-Laser Deposition