Solderability Testing of Microcircuits.

Abstract

Solderability tests were performed on Fe-Ni-Co and Fe-Ni microelectronic lead base materials with surface preparations as required by MIL-M-38510C. Test samples were used from four different sources. The solderability tests included MIL-STD-883A, Meniscograph and Hot Iron methods. Sample data from the three test methods showed good correlation. Microelectronic lead aging studies showed that the current steam aging environment should be retained. (Author)

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Document Details

Document Type
Technical Report
Publication Date
May 01, 1977
Accession Number
ADA041203

Entities

People

  • G. Schaefer
  • L. Zakraysek
  • R. Oehme
  • R. Ward

Organizations

  • General Electric

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Acquisition
  • Air Force
  • Air Force Facilities
  • Alloys
  • Containers
  • Direct Current
  • Environment
  • Inspection
  • Iron
  • Materials
  • Materials Laboratories
  • Measurement
  • Metric System
  • Plastic Explosives
  • Procurement
  • Test And Evaluation
  • Test Methods

Readers

  • Integrated Circuit Design and Technology.
  • Materials Science and Engineering.
  • Surface Engineering/Surface Coating Technology.

Technology Areas

  • Microelectronics