Basic Adhesion Mechanisms in Thick and Thin Films.

Abstract

The primary objective of this study is to construct models that will characterize the development of thick-film conductor adhesion, so that film properties may be predicted from the physical and chemical nature of the ink and substrate materials and from the processing to which these materials are subjected. The work of modeling the frit-bonded film adhesion strength has been divided into two parts: one is the development of the micro-structure; the other is the description of the adhesion strength in terms of the microstructure, the metal-phase/binder-phase interfacial adhesion, and other material properties. The study of reactively bonded and mixed-bonded inks seeks to model the formation of the binder-phase structure and to understand the behavior of that structure. This involves identification of the important structures, and the study of the kinetics of their formation.

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Document Details

Document Type
Technical Report
Publication Date
Apr 30, 1977
Accession Number
ADA041959

Entities

People

  • Kenneth R. Bube
  • Thomas T. Hitch

Organizations

  • RCA Corporation

Tags

Communities of Interest

  • Advanced Electronics

DTIC Thesaurus Topics

  • Adhesion
  • Aluminum Oxides
  • Chemical Synthesis
  • Chemistry
  • Classification
  • Contracts
  • Diffraction
  • Films
  • Identification
  • Kinetics
  • Liquid Phases
  • Materials
  • Microstructure
  • Particle Size
  • Physical Properties
  • Thick Films
  • Thin Films

Readers

  • Structural Health Monitoring of Composite Structures.
  • Surface Engineering/Surface Coating Technology.
  • Systems Analysis and Design